1. Multilayer ceramic substrate-technology for VLSI Package/multichip module
Author: Otsuka, Kanji
Library: Central Library and Information Center of Ferdowsi University of Mashhad (Khorasan Razavi)
Subject: ، Electronic ceramics,Materials ، Electronic packaging,Very large scale integration - Design and construction ، Integrated circuits,، Aluminum oxide
Classification :
TK
7871
.
15
.
C4
O8813
1993
